Winning Papers

Peter Rodgers

"Validation and Application of Different Experimental Techniques to Measure Electronic Component Operating Junction Temperature"

John Lohan, Peter Rodgers, Carl-Magnus Fager, Reijo Lehiniemi, Valérie Eveloy, Pekka Tiilikka, and Jukka Rantala
Transactions of IEEE CPMT, Vol. 22, No. 2, June 1999, pp.252-258

"Effect of PCB Thermal Conductivity on the Operating Temperature of an SO-8 Package in a Natural Convection Environment: Experimental Measurement versus Numerical Prediction"

John Lohan, Pekka Tiilikka, Peter Rodgers, Carl-Magnus Fager, Jukka Rantala
Proceedings of 5th THERMINIC Workshop, Rome Italy, October 3-6, 1999, pp.207-213

"Validating Numerical Predictions of Component Thermal Interaction on Electronic Printed Circuit Boards in Forced Convection Airflows by Experimental Analysis"

Peter Rodgers, John Lohan, Valérie Eveloy, Carl-Magnus Fager, and Jukka Rantala
Proceedings of InterPACK Conference, Maui, USA, June 13-17, 1999, Vol. 1, pp.999-1009

"Impact of Convective Environment on the Distribution of Heat Transfer from Three Electronic Component Package Types - Operating on Single- and Multi-Component Printed Circuit Boards"

Peter Rodgers, John Lohan, Valérie Eveloy, and Carl-Magnus Fager
Proceedings of 5th THERMINIC Workshop, Rome Italy, October 3-6, 1999, pp.214-220

"Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component Printed Circuit Boards in Natural Convection Environments"

Peter Rodgers, Valérie Eveloy, John Lohan, Carl-Magnus Fager, Pekka Tiilikka, and Jukka Rantala
Proceeding of SEMI-THERM XV, San Diego, CA, USA, March 9-11 1999, pp.54-64

"Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component Printed Circuit Boards in a Forced Convection Environment: Part 1 - Experimental and Numerical Modelling"

Peter Rodgers, Valérie Eveloy, John Lohan, Carl-Magnus Fager, and Jukka Rantala
Proceedings of ASME 33^rd NTHC, Albuquerque, NM, USA, August 15-17, 1999

"Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component Printed Circuit Boards in a Forced Convection Environment: Part 2 - Results and Discussion"

Peter Rodgers, Valérie Eveloy, John Lohan, Carl-Magnus Fager, and Jukka Rantala
Proceedings of ASME 33^rd NTHC, Albuquerque, NM, USA, August 15-17, 1999